The cost of production burn-in ovens can initially seem like a significant expenditure but in the long term it can reduce warranty costs and help device makers maintain a positive company reputation to win repeat orders. The challenge of production burn-in is to achieve a high throughput of devices with accurate measurements at the lowest possible cost.
CoC (Chip On Carrier) format is the earliest step between wafer and package. The earlier that burn-in and test is done in the manufacturing process – the most more cost effective it becomes.